v rm = 2 00 v , i f(av) = 20 a, trr = 25 ns(max.) fast recovery and high power diode ctx a - 4202 s ctx a - 4202 s - ds rev. 1. 1 sanken electric co.,ltd. 1 mar. 1 8 , 2 01 4 features the ctx a - 4202 s is a fast recovery diode which rea lize a peak reverse voltage of 2 00 v , a typ ical forward voltage drop of 0 . 90 v and typical trr of 18 ns optimizing a life - time control. it has the character istics suit for pfc circuit of ccm . the low thermal resistance package achieves high performance in terms of heat dissipation . ? v rm -------------------------------- ---------------------- 2 00 v ? v f -------------------------------- ---- 1. 2 v max . (i f = 1 0 a) ? i f(av) -------------------------------- ----------------------- 2 0 a ? t rr -------------------------------- -------------------- 25 ns max. (i f = 500 ma, i rp = 500 ma, 90 % of r.p.) applications ? for pfc circuit (ccm) ? for w hite g oods ? for t elecommunication d evice , etc. package to - 3p - 3 l not to scale absolute maximum ratings ? unless otherwise specified, t a is 25 c parameter symbol rating unit notes peak repetitive reverse voltage v rm 2 00 v average forward current i f(av) 2 0 a surge forward current i fsm 1 0 0 a 10 ms half sine wave, one shot i 2 t limiting value i 2 t 50 a 2 s 1 m s j ? stg ? electrical characteristics ? unless ot herwise specified, t a is 25 c parameter symbol test conditions min . t yp . m ax . unit forward voltage drop v f i f = 1 0 a ? r v r = v rm ? ? ? r v r = v rm , t j = 150 c ? ? rr i f = i rp = 500 ma, t j = 25 c , 90 % r ecovery point ? th(j - c) ? ? th(j - c) is thermal resistance between junction and case. case temperature (t c ) is measured at the under of th e screw hole of case . http://www.sanken - ele.co.jp/en/ (1) (2) (3) a k a ( 4 ) k
ctx a - 4202 s ctx a - 4202 s - ds rev. 1. 1 sanken electric co.,ltd. 2 mar. 1 8 , 2 01 4 performance curves 0.001 0.01 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 if a vf v vf - if typ.) ctxa - 4202s 150 100 60 25 1.e - 07 1.e - 06 1.e - 05 1.e - 04 1.e - 03 1.e - 02 0 50 100 150 200 ir a vr v vr - ir(typ.) ctxa - 4202s 150 100 60 25
ctx a - 4202 s ctx a - 4202 s - ds rev. 1. 1 sanken electric co.,ltd. 3 mar. 1 8 , 2 01 4 power dissipation curves i f(av) p f forward power dissipation (w) average forward current (a) v r p r reverse power dissipation (w) reverse voltage (v) t j = 150 c t/t=1/6 t/t=1/3,sinewave t/t=1/2 dc t j = 150 c 1 - t/t=5/6 sinewave 1 - t/t=2/3 1 - t/t=1/2 0 10 20 30 40 0 5 10 15 20 0 2 4 6 8 10 0 50 100 150 200 t t
ctx a - 4202 s ctx a - 4202 s - ds rev. 1. 1 sanken electric co.,ltd. 4 mar. 1 8 , 2 01 4 derating curves tl i f(av) v r = 0 (v) average forward current (a) lead temperature ( c ) tl i f(av) v r =20 0 (v) average forward current (a) lead temperature ( c ) t j = 150 c t/t=1/6 t/t=1/2 dc t/t=1/3,sinewave t j = 150 c t/t=1/6 t/t=1/2 dc t/t=1/3 sinewave 0 5 10 15 20 30 50 70 90 110 130 150 0 5 10 15 20 30 50 70 90 110 130 150 t t
ctx a - 4202 s ctx a - 4202 s - ds rev. 1. 1 sanken electric co.,ltd. 5 mar. 1 8 , 2 01 4 package outline to - 3p - 3 l notes: 1) dimension is in millimeters 2) pb - free. device composition compliant with the rohs directive marking diagram ( 1 ) p a r t n u m b e r x a 4 2 0 2 y m d d # b l o t n u m b e r y i s t h e l a s t d i g i t o f y e a r ( 0 t o 9 ) m i s t h e m o n t h ( 1 t o 9 , o , n o r d ) d d i s t h e d a t e ( t w o d i g i t o f 0 1 t o 3 1 ) # i s t h e l a s t d i g i t o f w a f e r l o t n u m b e r b e x p r e s s e s p b f r e e p i n s ( 2 ) ( 3 )
ctx a - 4202 s ctx a - 4202 s - ds rev. 1. 1 sanken electric co.,ltd. 6 mar. 1 8 , 2 01 4 operating precautions in the case that you use sanken products or design your products by using sanken products, the reliability largely depends on the degree of derating to be made to the rated values. derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assur e or improve the reliability. in general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self - he ating of semiconductor products. for these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. in addition, it should be noted that since power devices or ics including power devices have large self - heating value, the degree of derating of junction temperature affects the reliability significantly. because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. cautions for storage ? ensure that storage conditions comply with the standard temperature (5 to 35c) and the standard relative humidity (around 40 to 75%) ; avoid storage locations that experience extreme changes in temperature or humidity. ? avoid locations where dust or harmful gases are present and avoid direct sunlight. ? reinspect for rust on leads and solderability of the products that have been stored for a long time. cautions for testing and handling when tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. ensure all test parameters are within the ratings speci fied by sanken for the product s . remarks a bout using silicone grease with a heatsink ? when silicone grease is used in mounting the product s on a heatsink, it shall be applied evenly and thinly. if more silicone grease than required is applied, it may produc e excess stress. ? volatile - type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsin k. our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: type suppliers g746 shin - etsu chemical co., ltd. yg6260 momentive p erformance m aterials inc. sc102 dow corning toray co., ltd. cautions for mounting to a heatsink ? when the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has an extruded (burred) screw hole, the product s can be damaged , even with a lower than recommended screw torque. for mounting the products, the mounting surface flatness should be 0.05mm or less. ? please select suitable screws for the product shape. do not use a flat - head machine screw because of the stress to the product s . self - tapping screw s are not recommended. when using self - tapping screws, the screw may enter the hole diagonally, not vertically, depending on the conditions of hole before threading or the work situation. that may stress the products and may cause failures. ? recommende d s crew t orque : package recommended screw torque to - 220 , to - 220f 0.490 to 0.686 n ? ? ? ? ? ? ? for tightening screws, if a tightening tool (such as a driver) hits the product s , the package may crack, and internal stress fractures may occur , which shorten the lifetime of the electrical element s and can cause catastrophic failure . tightening with an air driver makes a substantial impact. in addition, a screw torque higher than the set torque can be applied and the package may be damaged. therefore, an electric driver is recommended. when the package is tightened at two or more places, first pre - tighten with a lower torque at all places, then tighten wit h the specified torque . when using a power driver, torque control is mandatory.
ctx a - 4202 s ctx a - 4202 s - ds rev. 1. 1 sanken electric co.,ltd. 7 mar. 1 8 , 2 01 4 ? please pay special attention about the slack of the press mold. in case that the hole diameter of the heatsink is less than 4 mm, it may cause the resin crack at tightening. soldering ? w hen soldering the products, please be sure to minimize the working time, within the following limits: ? 260 5 c 10 1 s (flow, 2 times) ? 380 10 c 3 .5 0.5 s (soldering iron , 1 time ) ? soldering should be at a distance of at least 1.5 mm from the body of the products. important notes ? the contents in this document are subject to changes, for improvement and other purposes, without notice. make sure that this is the latest revision of the document before use. ? application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of sanke n or any third party which may result from its use. ? unless otherwise agreed in writing by sanken, sanken makes no warranties of any kind, whether express or implied, as to the products, including product merchantability, and fitness for a particular purpo se and special environment, and the information, including its accuracy, usefulness, and reliability, included in this document. ? although sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semi conductor products at a certain rate is inevitable. users of sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the soc iety due to device failure or malfunction. ? sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, mea suring equipment, etc.). when considering the use of sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest sanken sales representative to discuss, prior to the use of the products herein. the use of sanken products without the written consent of sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. ? when using the products specified herei n by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. ? anti radioactive ray design is not considered for the products listed herein. ? sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of sankens distribution network. ? the conte nts in this document must not be transcribed or copied without sankens written consent.
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